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HSIs Grant Deadline: FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

April 12

This Notice of Funding Opportunity (NOFO) seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives:
(1) Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
(2) Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
(3) Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
(4) Promote a skilled and diverse pipeline of workers for a sustainable domestic
advanced packaging industry.

NAPMP plans to release subsequent NOFOs relevant to other research areas and for an Advanced Packaging Piloting Facility (APPF), where successful development efforts will be transitioned and validated for scaled transition to U.S. manufacturing. The APPF is expected to be a key facility for technology transfer to high-volume manufacturing.

Concept papers are due April 12, 2024. This is a requirement to be invited to submit a full application